LPKF ProtoFlow S Oven

photo of LPKF ProtoFlow S Reflow Oven at Ohio State

The ProtoFlow S is a high tech, user friendly, reflow oven with many pre-programmed process profiles which can be easily selected via the LCD display and keypad. This equipment is ideal for prototyping, technology research and pre-production runs. The intuitive software package enables process parameters to be conveniently changed, managed and archived on a PC. Several user-programmable zones between preheating and final reflow enable the LPKF ProtoFlow S to process all reflow profiles up to 320 deg. C.

Dimensions (W x H x D) 647 mm x 315 mm x 450 mm (25.5” x 12.4” x 17.7”)
Weight 22 kg (48.5 lbs)
Max. PCB size 230 mm x 305 mm (9” x 12”)
Max. preheat temperature/time 220 °C (428 °F), 999 s
Max. reflow temperature/time 320 °C (608 °F), 600 s
Long thermal treatment temperature/time 220 °C (428 °F), 64 h
Temperature stabilizing time < 5 min
Power supply 230 V, 50 – 60 Hz, single-phase, 3.2 kW